2024/3/6
型号:HG1400CMP抛光垫;白色;
硬度:邵D70-75;无填料;
密度:0.9±5;
适用于半导体晶体和硬质合金的精密抛光。产品稳定性更好,使用寿命更长,平整度更加一致。
Model:HG1400CMP Polishing Pad;
Color:White;
Hardness:Shore A70-75;No Fillers;
Density:0.9±0.05;
Suitable for precision polishing of semiconductor crystals and hard alloys.It ensures better stability,longer service life,and more consistent flatness of the processed workpieces.
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